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Inverter H100 LS

Rp. CALL
Last Updated
21 Sep 2021
Country Origin
Saudi Arabia
Minimum Order
1 Unit
Category
Inverter

Specification of Inverter H100 LS

Inverter dan Konverter



Inverter H100 LS



Fan and Pump AC Drive



KEYPAD EXCLUSIVE FOR HVAC

Used to issue commands, configure drive parameters, and for monitoring drive status



- HAND mode (Local, Control, Mode) or AUTO Mode (Remote Control Mode) can be selected.



- HAND Mode :

Used when selecting frequency or run/stop commands.



- AUTO Mode :

Drive operated using the keypad. multifunctional terminal block and communic



- Fault Status Monitoring



SPECIFICATION LEVEL OPTION (CONDUIT KIT)

Acquired UL open type & enclosed type 1 certification



- When the conduit option is used, the drive meets UL Enclosed Type 1 specifications 





FLANGE TYPE

If the space is too small, a heat sink can be installed outside the panel



COMMUNICATION MODULE

RS-485 Capability is built-in

Modbus-RTU, Metasys N2

BACnet MS/TP is embedded as standard

LonWorks option can be added





COMMUNICATION MODULE

It is easy to change a cooling fan without opening the cover of a drive



DC REACTOR

A built-in DC Reactor effective to improve power factor and reduce THD is installed.



DC Reactor built-in as standard for 400V 37-90kW

BUILIT-IN EMC FILTER

A built-in EMC fiter to respond to the specifications for noise reduction



400V 0.75~30kW Built-in as default (C3)

400V 37~55kW Built-in option can be selected (C3)

75~90kW satisfies EMC specifications even without a filter.

GLOBAL SPECIFICATIONS COMPLIANT

UL Plenum Rated (American standards for conditioner fire safety)



suitable for installation in a Compartment Handing onditioned Air

SMART COPIER

Power-free Operation

LED Feedback

Parameters Read/Write

Easy to Install

SIDE-BY-SIDE INSTALLATION



The size of control board is significantly reduced when multiple drives are installed by minimizing distance between products installed.

Sibe-by-side installation is unavailable for 37~90kW.

REDUCED SIZE



Main Components are optimally deployed through thermal radiation analysis and 

3D design to reduce size by 34% compared to iP5A(Volume based).


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